摘要
结构分析是一种重要的电子元器件可靠性评估方法。通过结构分析可以评估元器件内是否存在潜在的缺陷,为元器件的固有质量和固有可靠性的判断提供重要的依据。介绍了结构分析的一般技术流程,并将其应用于某型号半导体器件外壳的结构分析工作中,最后给出了有关结构分析工作的几点建议。
Constructional analysis is an important method for evaluating the reliability of electronic components. Whether there is any potential defects within the components can be evaluated and an important basis for the judgment of the inherent quality and inherent reliability can be provided through constructional analysis. The general technical process of constructional analysis is introduced, and it is applied in the constructional analysis of the shell of a semiconductor device. Besides, some suggestion on constructional analysis are given.
出处
《电子产品可靠性与环境试验》
2017年第4期57-61,共5页
Electronic Product Reliability and Environmental Testing
关键词
结构分析
可靠性评估
外壳
建议
Constructional Analysis
reliability evaluation
shell
suggestion
