摘要
采用氮化硼和氧化铝粉体制备了一种填充型环氧灌封材料,通过研究填充量和导热系数与体系混合黏度之间的关系,开发出一种低黏度高导热的双组分环氧灌封材料,并对其性能进行测试分析。结果表明:该环氧灌封材料的导热系数可达1.20 W/(m·K),且80℃时黏度仅为1.1×10~3m Pa·s。
A filled-type epoxy resin potting compound was prepared by BN and Al_2O_3 powders. Accord- ing to the effect of filler content on thermal conductivity and viscosity of the composite, a bi-component epoxy resin potting compound with high thermal conductivity and low viscosity was developed, and its properties were tested and analyzed. The results show that the thermal conductivity of the compound could reach 1.20W/（m·K）, and its viscosity at 80 ℃ is only 1.1×10-3mPa·s.
出处
《绝缘材料》
CAS
北大核心
2017年第8期70-72,共3页
Insulating Materials
关键词
导热系数
环氧
氮化硼
氧化铝
thermal conductivity
epoxy resin
BN
Al_2O_3
