梯度钨/铜复合材料残余应力的研究

Residual Stress Studies of Graded W/Cu Materials

高导热导电的铜和高热阻的钨组成的复合材料在工业中有广泛的应用。然而,不同的膨胀系数使得它们很难共存在一起。解决的办法之一是用它们制造成具有梯度的钨/铜复合材料。用粉末冶金法制备铜钨合金(重量比W∶Cu=80∶20)得到样品,用自动应力仪(DIA)做应力测量和中子衍射确定不同钨/铜梯度复合材料的宏观应力及微应力。结果表明,形变应力可以通过后续的热处理避免,并可大幅地改变微应力;随着铜相衍射线扩大,屈服强度增加,达到300 MPa。

The combination of high thermal and electrical conducUvlty oI copper wnn thermal resistance of tungsten is of great interest for industry. The different heat expansion coefficients,however,pose a serious problem to the coexistence of the two phases. The possible solution can be found in creating a composition gradient between the two metals. Using powder metallurgy of tungsten copper alloy prepared by （weight ratio W：Cu=80：20） to get the sample, the use of DIA in stress measurement and neutron diffraction to determine different tungsten/copper gradient composites both macro and micro stresses. The results show can significantly change that the deformation stress the micro stress; With the can be avoided by subseque expanding of copper phase nt heat treatment, and diffraction line,yield strength increases, up to 300 MPa.