两层堆叠3D-IC层间液体冷却流动及换热特性

Flow and heat transfer characteristics of interlayer liquid cooling for 3D-IC with two stacked layers

随着电路层的垂直堆叠,三维集成电路(3D-IC)的功耗密度成倍增加。具有良好散热能力的层间液体冷却是一种非常有效的方法。采用数值模拟的方法研究了雷诺数在150~900范围内面积为1cm^2,针肋直径为100μm,通道高为200μm,通道间距为200μm的带有层间顺排微针肋两层芯片堆叠3D-IC内流体流动与换热特性。结果表明:与相应尺寸的矩形通道结构相比,带有层间顺排微针肋液体冷却3D-IC具有良好的换热效果。在雷诺数为770时,芯片的功率高达250W,其体积热源相当于8.3kW/cm^3;较矩形结构通道,顺排微针肋结构的热源平均温度和热源最大温差只有46.34,13.96K,分别减小了13.26,21.34K。

With the vertical stacking of circuit layers, the power density of 3D-IC increases exponentially. Interlayer liquid cooling is a promising and scalable solution for high heat flux removal in 3D-IC （three-dimensional integration circuit）. The flow and heat transfer performances of water through uniform and double-side heat flux 3D-IC of interlayer in-line micro-pin fins structure with heat transfer areas of 1 cm2 and Reynolds number ranging from 150 to 900 were studied numerically. 3D-IC with in-line micro-pin fins for pitches of 200/~m, diameter of 100/~m and heights of 200/~m was analyzed. Results show that interlayer liquid cooling of 3D-IC with in-line micro-pin fins has better heat exchange effect than that with rectangular micro-channels. For the Reynolds number of 770, the power reaches to 250 W, which is equivalent to 8.3 kW/cm3 volumetric heat. Compared with rectangular micro-channels, the average temperature and the maximal junction temperature of the heater surface with in-line micro-pin fins are only 46.34, 13.96K, down by 13.26, 21.34K, respectively.