集成电路封装用绝缘胶漏电失效分析

Analysis of Leakage Failure of Insulation Adhesive in IC Package

在电子元器件封装领域中,塑封器件正逐步替代气密性封装器件。目前工业级塑封器件已不能满足器件的高可靠性要求,工业级塑封器件在严酷的环境应力试验中经常出现失效。研究了工业级塑封器件在可靠性筛选试验中出现失效的问题,通过X射线观察和芯片切面分析等方法,查明了造成器件失效的原因,并提出了优化改进措施。

Hermetic encapsulated devices were gradually replaced by plastic encapsulated devices in the field of electronic packaging. But the current industrial-grade encapsulated devices could not meet the requirement of high reliability. The industrial-grade plastic encapsulated devices often failed in harsh environmental stress tests. In the reliability screening test,the failures of industrial-grade encapsulated devices were studied. The reasons of failure were found out by means of X-ray observation and chip section analysis,and the optimization and improvement measures were put forward.