Sn0.3Ag0.7Cu-xPr无铅钎料显微组织和力学性能研究

本文对Sn0.3Ag0.7Cu-x Pr钎料的显微组织和力学性能进行了试验研究。结果表明,微量稀土Pr的添加可以有效细化Sn0.3Ag0.7Cu钎料的显微组织和显著提高钎料的拉伸强度。Sn0.3Ag0.7Cu-0.1Pr钎料的基体组织得到最大程度的细化以及均匀化,金属间化合物颗粒尺寸明显减小,钎料的拉伸强度和延展性也达到了最大值,拉伸断口出现细小均匀的韧窝,呈明显的韧性断裂特征。当稀土Pr含量继续升高时,钎料的力学性能恶化,这与基体组织中出现的大块PrSn_3稀土相有关。

The microstructure and mechanical properties of Sn0.3Ag0.7Cu-xPr lead-free solders were investigated. The results indicate that the addition of Pr can refine the microstructure and enhance the mechanical properties. The microstructure were refined maximum and even on Sn0.3Ag0.7Cu-0.1Pr solder, in which the size of intermetallic compound particals could be reduced, too. At this time, the mechanical properties of solder have the peak value. The tensile fracture shows that small dimples can be seen and the toughness fracture can be demonstrated.