COG绑定工艺中粒子压痕不均问题的研究及改善

Solving IC Uneven Indentation Problems in COG Bonding Process

随着LCD(Liquid Crystal Display,液晶显示屏)技术的不断发展,人们对轻薄化的电子产品倍加宠爱,进而追捧微型组件技术,COG技术正是这众多技术中的一种。COG是英文"chip on glass"的缩写,即IC(Integrated Circuit)通过ACF(anisotropic conductive film各向异性导电胶)被直接绑定在LCD上,而COG IC在绑定工艺中经常发生ACF粒子压痕不均的问题,进而产生进行性的功能不良。文章通过对IC内部引脚(Bump)的设计优化,可以解决IC压痕不均的问题。文中的结论对生产中COG邦定工艺粒子压痕问题的改善有很大作用,并且已经在企业生产中得以应用。

With the continuous development of LCD technology,people are more and more fond of the frivolous electronic products, and then pursue the micro component technology.COG is one of the many technology.COG is the abbreviation of ＂chip on glass＂ in English.The IC by ACF （anisotropic condu directly.COG IC often occurs in the bonding process the ctive film of anisotropic conductive film） were bonding on the LCD problem of uneven indentation, resulting in progressive dysfunction. Based on IC design optimization of the internal Bump,obtained through the COG IC internal pins （Au bump） the rationalization of design can solve the problem of uneven IC indentation.The conclusion of this paper on the improvement of the production of COG bonding process had very big effect,and had been applied in enterprise production.