摘要
文章详细论述了电镀厚金工艺在微带板表面涂覆过程中的应用,并对生产过程中存在的技术问题进行分析、研讨。
The paper discusses the application of thick gold plating process on microstrip board in the process of surface coating, and analyzes and discusses the technical problems during production.
出处
《印制电路信息》
2017年第9期39-41,共3页
Printed Circuit Information
关键词
微带板
表面涂覆
电镀厚金
Microstrip Board
Surface Coating
Thick Gold Plating
