印制电路板熔合工艺的影响因素分析

Analysis of influence factor of the fusion process for PCB

本文对印制电路板压合工艺中各因素对熔合定位方式的熔合效果进行了分析。结果表明:长方形热熔头的面积较圆形热熔头大,其产生的结合力明显优于圆形热熔头;熔合温度越高,熔合时间越长,熔合扩散区越大;相同熔合时间及温度下,PP结构越薄,越适合熔合工艺。

This paper made analysis on influence factor of the fusion process for PCB. The results showed that the heating area of rectangle fusion head was much larger than that of the circle fusion head, thus the adhesive strength resulted by the rectangle fusion head was also obviously superior. The fusion temperature was higher and the fusion time was longer, the diffusion region of fusion was larger. At the same under the fusion temperature and time, the fusion process would be more suitable if the PP structures were thinner.