期刊文献+

基于量纲理论的分裂导线集成载流量综合性研究 被引量:1

Comprehensive Research of Integrated Current-carrying Capacity of Overhead Bundled Conductor Based on Dimensional Theory
下载PDF
导出
摘要 随着分裂导线的应用越来越广泛,线路容量的问题越发不可忽视。然而,分裂导线载流量计算与单根导线存在一定的差异,无法依据现有的导线载流量计算公式得到结果。通过分裂导线的载流量试验,模拟分裂导线实际运行,使用量纲分析,对分裂导线的集成载流量进行研究,得到了在实验室环境下分裂导线的实际载流量值,得出了分裂导线集成载流量与单根导线载流量的数学关系,为线路设计和改造提供了有力的技术支撑。 With the extensive application of bundled conductor, the problem of line capacity cannot be ignored. However, there are some differences in current-carrying capacity calculation between bundled conductor and a single conductor. The current-carrying capacity of bundled conductor cannot be calculated by the existing calculation formula. This paper simulates the actual operation of bundled conductor by current-carrying capacity test and uses dimensional analysis to investigate the integrated current-carrying capacity of bundled conductor. The research obtains the actual current-carrying capacity in the laboratory environment and mathematical relationship of the current-carrying capacity between bundled conductor and a single conductor,providing a powerful technical support for design and reconstruction of lines.
出处 《浙江电力》 2017年第8期13-17,34,共6页 Zhejiang Electric Power
基金 国网浙江省电力公司科技项目(5211DS14004W)
关键词 分裂导线 载流量 试验 量纲分析 bundled conductor current-carrying capacity test dimensional analysis
  • 相关文献

参考文献4

二级参考文献34

  • 1沈一春,宋牟平,章献民,陈抗生.长距离光纤布里渊散射研究[J].光子学报,2004,33(8):931-934. 被引量:12
  • 2叶鸿声,龚大卫,黄伟中,赵君虎,周丹羽,沈潜,周康,袁志磊.提高导线允许温度的可行性研究和工程实施[J].电力建设,2004,25(9):1-7. 被引量:51
  • 3陈军,李永丽.应用于高压电缆的光纤分布式温度传感新技术[J].电力系统及其自动化学报,2005,17(3):47-49. 被引量:49
  • 4徐青松 季洪献 王孟龙.监测导线温度实现输电线路增容新技术.电网技术,2007,(30):171-171.
  • 5叶鸿声.龚大卫.提高导线允许温度增加线路输送容量的研究(一、二)]C].中国电机工程学会输电电气四届二次学术年会论文集,西安,2005:1-17.
  • 6V.T. MORGAN. The Thermal Rating of Overhead-line Conductors. Part 1 ,The Steady-State Thermal Model [ J ].Electric Power System Research, 1982,5:119-122.
  • 7王春江.电线电缆手册(第1册)[M].北京:机械工业出版社.2008.
  • 8REN WAN-BIN, LIANG HUI-MIN, ZHAI GUO-FU. Thermal Analysis of Sealed Electromagnetic Relays in High and Low Temperature Condition[ C ]. Proceedings of 52nd IEEE Holm Conference on Electrical Contacts, 2006, 110-116.
  • 9LIANG HUI-MIN, WANG WEN-LONG, ZHAI GUO-FU. Thermal Analysis of Sealed Electromagnetic Relays Using 3D Finite Element Method[ C ]. Proceedings of 53rd IEEE Holm Conference on Electrical Contacts, 2007, 262-268.
  • 10LI ZHENG-BIAO, ZHENG BI-CHENG, HE ZHENG-JIE. The Numerical Thermal Analysis for Automotive Relay[C]. Proceedings of 24^th International Conference on Electrical Contacts, Saint-Malo, France, June 9-12, 2008.

共引文献24

同被引文献2

引证文献1

二级引证文献2

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部