摘要
当今的设计人员和工程师面临着日益加剧的设计挑战,因此很有必要拥有一款能够高效率支持射频和微波设计的PCB设计工具。手动建立复杂的铜箔形状、倒角和via模式是一个既耗时又容易出错的过程。透过使用有效的设计工具提高操作射频和微波元素的能力,设计人员可以集中精力实施更多功能和缩小设备尺寸,同时保持较高的产品质量。
Today's designers and engineers are faced with increasing design challenges, so it is necessary to have a PCB design tool that can efficiently support RF and microwave design. Manually building complex copper foil shapes, chamfering and via patterns are time- consuming and error-prone processes. By using effective design tools to improve the ability to operate radio frequency and microwave elements, designers can concentrate on implementing more functions and reducing device size while maintaining high product quality.
出处
《集成电路应用》
2017年第9期40-42,共3页
Application of IC
基金
吉林省科技型中小企业技术创新基金(11C26212200625)
关键词
电路设计
射频
微波
倒角
via模式
circuit design, RF, microwave, chamfering, via mode