铜板大面积U型对接电阻钎焊研究

Study on Large Area U Type Butt Resistance Brazing of Copper Plate

采用电阻钎焊对厚度较大的铜板U型对接接口进行了焊接,分析了焊接结构对钎焊钎着率、焊缝微观组织的影响。结果表明,电阻钎焊可以将焊缝周围的母材整体加热,易于钎料的整体填充焊缝,钎着率高于火焰钎焊。电阻钎焊时在钎焊缝周围预置焊料槽可以有效地补充钎焊缝,有利于气体的排出和钎剂残渣的上浮,大大降低了气孔的产生和钎剂残渣的残留。钎着率达到95%,钎焊缝连续均匀,无明显的缺陷,钎焊接头抗拉强度达到202 MPa,接近T2母材的强度。

The U-shaped docking interface of copper plates with big thickness was welded by resistance brazing, and the effects of welding structure on the brazed rate and weld microstructure were studied. The results show that the resistance brazing can heat the base metal around the weld, which makes the solder flU the weld easily, and the brazed rate is higher than that of torch brazing. Solder grooves preseted around the weld can supple the brazing seam effectively, and it is useful for the gas discharge and flux residue floating, which greatly reduces the stomata and residual flux residue. The brazed rate can achieve 95%, and the weld is uniform and has no obvious flaws. The tensile strength of the brazing joint achieves 202 MPa, which is close to the tensile strength of T2 base metal.