铜合金表面电火花及激光沉积制造技术的研究

Research of electrical discharging and laser cladding depositions on copper alloy

分别采用电火花沉积和激光熔覆技术在铜合金表面制备了不同组织和性能的沉积层,用SEM,XRD,OM和显微维氏硬度计进行了组织结构和性能分析,结果表明:在铜合金表面可采用激光熔覆的方法制备异质的沉积层,沉积层与铜基体冶金结合,其组织致密、晶粒细小、无裂纹和孔隙夹杂等缺陷,沉积层内部组织形貌为等轴晶、树枝晶及胞状晶等;电火花沉积工艺可在铜合金表面形成铜基的沉积制造层,电火花层与铜基体形成冶金结合,其组织致密、晶粒细小、无裂纹、孔隙夹杂等缺陷.

On the surface of copper alloy, microstructure and were produced prepared by electrical discharging deposition and laser cladding processes with different depositions methods, respectively. The deposits were analyzed and measured by SEM, XRD, OM for the microstructure, element content and micro hardness property by hardness ,tester. The results show that the microstructure of cladding layer process by laser cladding is heterogeneous, metallurgical combination with the copper substrate, compact structure, fine grain, without crack, pore inclusions and other defects, and the cladding layer with equiaxed dendrite and columnar crystal structure. Similarly, the EDD process can form a copper based deposition on the surface of copper alloy, and the layer also forms metallurgical combination with the copper matrix, and has the defects of compact structure, fine grain, no crack, pore inclusion etc.