大豆种子与排种器接触物理参数的测定与离散元仿真标定

Measurement of physical parameters of contact between soybean seed and seed metering device and discrete element simulation calibration

研究大豆排种过程的离散元仿真参数设置。对大豆种子的本征参数、大豆种子与排种器的接触参数进行标定;测定大豆种子长、宽、高三轴尺寸,自然休止角,千粒重和密度的本征物理参数,测定大豆种子与排种盘、搅种轮和有机玻璃接触的最大静摩擦因数、碰撞恢复系数。以平均误差值为评价指标,应用离散元软件正交试验仿真标定。结果表明,离散元仿真标定的参数设置为:大豆种子三轴尺寸的长、宽、高分别为6.884、6.833、6.292mm,密度为1 272.15kg/m^3;大豆种子与排种盘、搅种轮和有机玻璃的最大静摩擦因数分别为0.449、0.408、0.474,碰撞恢复系数分别为0.561、0.518、0.472,离散元仿真的平均误差值为2.044%。

In order to study the parameter setting of discrete element simulation,the intrinsic parameters of soybean seed and the contact parameters of soybean seed and seed metering device were calibrated.The physical parameters of three axial dimensions,natural repose angle,1 000 grain weight and density were determined.The maximum contact coefficient and contact coefficient of soybean seed and seed plate,seed wheel and organic glass were measured.The discrete element software is used to calibrate the orthogonal test,and the average error value is the evaluation index.The results show that the parameters of discrete element simulation calibration are：the length,width and height of three axis of soybean seeds were respectively 6.884,6.833 and 6.292 mm,and the density of soybean seeds was 1 272.15 kg/m^3;The maximum static friction coefficients of soybean seed and seed plate,seed wheel and plexiglass were 0.449,0.408,and 0.474,respectively;The recovery coefficient of soybean seed and seed plate,seed wheel and plexiglass were 0.561,0.517 8,and 0.472,respectively.The average error of discrete element simulation is 2.044%.