摘要
In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-SSb solder which has a higher melting point temperature than that of Sn- Ag-Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propa- gation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn-5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.
In this study, a crack initiation and propagation behavior of Sn-5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push-pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-SSb solder which has a higher melting point temperature than that of Sn- Ag-Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propa- gation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn-5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.
