6061铝合金与H60铜合金TIG热导焊接头组织与性能

Microstructure and properties of aluminum 6061/copper H60 welded joint by tig conduction welding

采用TIG电弧加热H60铜合金,依靠热传导使6061铝合金熔化,从而实现铝/铜异种金属的可靠连接。使用扫描电子显微镜(SEM)、能谱分析(EDS)和X射线衍射(XRD)等分析测试方法对铝/铜接头微观组织进行观察和分析;研究了不同焊接电流对铝/铜接头界面组织和力学性能的影响。结果表明:铝/铜接头界面组织为铜合金母材/Al_4Cu_9反应层/Al_2Cu反应层/α-Al+Cu_5Zn_8+Al_2Cu相/铝合金母材;随着焊接电流的增加,靠近铜合金母材侧Al_4Cu_9+Al_2Cu反应层的厚度逐渐增加,当焊接电流达到110 A,接头界面处可以观察到明显的裂纹;随着焊接电流的增加,铝/铜接头的拉伸载荷呈现出先上升后下降的趋势,最大拉伸载荷为1.67 kN。

To achieve the reliable joining of aluminum 6061 and copper H60, copper alloy was heated by TIG arc to melt the aluminum alloy.The microstructure of the joint was analyzed by scanning electron microscope(SEM), energy dispersive spectrometer(EDS) and X-ray diffraction(XRD). The effect of welding current on the microstructure and properties of the joints was investigated. The results revealed that the microstructures of the joint are copper substrate/Al_4 Cu_9 layer/Al_2 Cu layer/α-Al + Cu_5 Zn_8 + Al_2 Cu phases/aluminum substrate. The thickness of Al_4 Cu_9 + Al_2 Cu layers near to the copper substrate is increased with the increase of welding current. However, when the welding current reached 110 A, micro-cracks were observed along the copper substrate. The tensile load increases with the increase of welding current until maximum tensile load of 1.67 kN was reached,and then decreases at higher welding current.