摘要
文章分析了电动汽车对IGBT器件的特殊要求,总结了国内外知名厂商针对电动汽车IGBT芯片、模块封装的最新技术路线与研究现状,同时介绍了国内外典型电动汽车IGBT产品的技术特点与应用情况;展望了电动汽车用IGBT器件的未来发展趋势,指出未来电动汽车用IGBT将向更高功率密度、更高工作结温、更高可靠性以及小型化、智能化、定制化的方向发展。
This paper analyzed the special requirements of IGBT in electric vehicle, and summarized the latest technology roadmap and research status of the automotive IGBT chip technology and module interconnection of some well-known semiconductor manufacturers in the world. The technology characteristics and application of typical automotive IGBT module of different manufacturers were introduced. The development trends of automotive IGBT chip and module were prospected and it is found that more high power density, high junction temperature, high reliability and miniaturization, intelligence, customization are the development directions.
出处
《大功率变流技术》
2017年第5期29-35,共7页
HIGH POWER CONVERTER TECHNOLOGY
基金
国家重点研发计划(2016YFB0400403)
关键词
电动汽车
IGBT芯片
封装技术
应用前景
electric vehicle
IGBT chip
packaging technology
application prospect
