电动汽车功率模块平面封装技术

Planar Packaging Technology of Power Semiconductor Module for Electric Vehicle

讨论了目前电动汽车用功率模块典型的平面封装技术;介绍了汽车功率系统对功率模块的性能要求,以及汽车模块封装面临的挑战和应对措施;讨论了当前典型的采用平面封装技术的电动汽车功率模块,分析其结构和封装技术等;并展望了汽车级平面模块封装技术的下一步发展方向。

In this paper, the typical planar packaging technologies of HEWEV power semiconductor module were presented. Firstly, the functionality and performance requirements for power module by automotive power system, as well as the challenges and mitigation strategy of automotive power module packaging, were discussed. The typical state-of-the-art HEV/EV modules assembled by planar technology were reviewed and analyzed in terms of the structure and packaging technologies. Finally, the outlook of next generation key packaging technologies of planar automotive module was proposed.