单面研磨抛光晶片研磨一致性研究

Consistency about Single Abrasive Polishing Wafer Lapping

针对LED衬底材料蓝宝石在单面研磨抛过程存在的研磨一致性问题。从运动学理论出发,计算陶瓷盘上任意点的绝对运动方程;通过计算公式来判断任意点的研磨速度;揭示了研磨(抛光)盘和研磨(抛光)头角速度的变化对蓝宝石晶片研磨一致性的影响。

LED sapphire substrate material for grinding polishing process in the presence of single-sided grinding consistency issues. From the kinematic theory to calculate any point on the ceramic plate absolute motion equations. Determine the polishing rate at any point by calculating formula. Have revealed that the angular velocity of the lapping （polishing） plate and the lapping （polishing） head, which can affect the polishing rate of the sapphire wafer.