热像仪对QFN封装表面发射率环境透射率的标定

Surface emissivity and the environment transmittance calibration for QFN package with thermal imager

使用红外热像仪对未切割分离的QFN封装在40~200℃进行了塑封料面、铜面和"缝"表面发射率的标定,并分别利用上述三面对实验环境的空气透射率进行了标定。结果表明:直接计算法和直接调节法可以很好地应用于塑封料发射率标定,直接计算法可以应用在"缝"处、铜面发射率标定。塑封料发射率标定结果在0.97左右;"缝"处发射率标定值随着温度升高由0.17~0.35呈线性递增趋势变化;铜面发射率标定值随温度升高出现先稳定后增大趋势。塑封料面、铜及"缝"处对空气透射率标定值在100%左右,上下波动不超过2%。该实验结果可为红外热像仪测定QFN的使用温度及切割分离时的温度提供相应参数。

Using infrared thermal irnager calibrated the epoxy molding compound （EMC）, copper, copper joints surface emissivity of not separated QFN package within 40-200 ℃, using the above three surface calibrated the air transmittance. The results show that the direct calculation method and direct adjustment method can be well applied in the calibration of EMC, direct calculation method can be well applied in the calibration of copper joints and copper solder. The emissivity calibration results of EMC is in 0.97 or so; the emissivity calibration results of copper joints with a linear change from 0.17 to 0.35 when the temperature increased; the emissivity calibration value of copper surface increased after the first stabled. The air transmittance calibration value of EMC surface and copper joints were around 100%, fluctuated less than 2%. The experimental results could provide some corresponding parameters for infrared termograph during the process measuring QFN using temperature and cutting separation temperature.