摘要
研究了Ca-Si-Al-B和Bi-Si-Al-B两种不同玻璃粉对片式电阻面电极(C1)耐焊处理前后电阻率的影响。结果表明,当Ca-Si-Al-B玻璃质量分数为4%~6%时,C1产品具有良好的电性能以及优异的耐焊特性。SEM和EDS分析表明含有Ca-Si-Al-B玻璃的C1经耐焊处理后导体层保留有较厚且连续的银层,这主要是由于Ca-Si-Al-B玻璃粉在烧结时形成的钙长石针状结构对银的"封锁"和与钎料较大的表面张力造成。
The effects of two kinds of frits, Ca-Si-Al-B and Bi-Si-Al-B on resistivity of chip resistor surface electrode （C1） were studied before and after dealing with soldering. The results show that CI products have good electrical property and excellent solder-resistance property when mass fraction of Ca-Si-Al-B glass powder is 4%-6%. The analyses of the SEM and EDS declare that the silver layer of the C1 is well-stacked and continuous, which contains Ca-Si-Al-B glass powder after solder-resistance. This is mainly due to the silver being cordoned off by the calcium feldspar needle structure during the Ca-Si-Al-B glass powder sintering and the larger surface tension of the solder.
作者
赵科良
梅元
徐小艳
党莉萍
陆冬梅
ZHAO Keliang MEI Yuan XU Xiaoyan DANG Liping LU Dongmei(Xi＇an Hongxing Electronic Paste Co., Ltd, Xi＇an 710065, China)
出处
《电子元件与材料》
CAS
CSCD
2017年第10期37-40,45,共5页
Electronic Components And Materials
基金
陕西省高新技术产业发展专项项目资助(No.GX12003)
关键词
银浆
片式电阻
面电极
耐焊性
玻璃粉
无铅钎料
silver paste
chip resistor
surface electrode
solder-resistance
flit
lead-flee solder
