3D芯片绑定中测试绑定次序对成本的影响

The Bonding Order's Impact on Cost During Mid-Bond Test of 3D Chip

针对3D SICs(3D Stacked Integrated Circuits,三维堆叠集成电路)在多次绑定影响下的成本估算问题,现有的方法忽略了实际中经常发生的丢弃成本,从而使得理论的测试技术不能很好的应用于实际生产.本文根据绑定中测试的特点,提出了一种协同考虑绑定成功率与丢弃成本的3D SICs理论总成本模型.基于该模型,提出了一种3D SICs最优绑定次序的搜索算法.最后,进一步提出了减少绑定中测试次数的方法,实现了"多次绑定、一次测试",改进了传统绑定中测试"一绑一测"的方式.实验结果表明,本文提出的成本模型更贴近于实际生产现状,最优绑定次序、最优绑定中测试次数可以更加有效指导3D芯片的制造.

Nowadays,due to the lack of appropriate 3D SICs（ 3D Stacked Integrated Circuits） cost estimation methods under the impact of the multiple bonding,and the generally neglect of the discarding costs in test process production,the existing test methods can not be well applied in the actual production. Based on the feature of mid-bond test,this paper proposed a 3D SICs theoretical total cost model,by synergistically considering the bonding rate and discarding cost,further,a3 D SICs optimal bonding order algorithm is proposed. Finally,the paper also puts forward a method to optimize the midbonding test times. This method can achieve ＂ multiple bondings but plus one test＂ by replacing the traditional ＂ one bonding and plus one test＂ method. Experimental results showthat the cost of the proposed model is closer to the actual production.Optimal bonding order and Optimized mid-bonding test times can be effective to guide the 3D chip manufacturing.