阶梯状线路工艺研究

Research on ladder circuit technology

文章文采用抗腐蚀金属金保护线路面,同时采用金面镀铜的方式加厚铜层,再次贴抗蚀干膜,覆盖薄铜区域,显影后露需要加厚铜的网络线路,镀铜后镀金,得到厚铜区域的线路。退膜后由金保护线路,蚀刻基铜实现多层阶梯线路的方法。

This paper describe that the circuit is protected by Au as anti-etching metal. At the same time copper is electroplated on the surface of gold. Thin copper is covered with anti-etching film, and thick copper is exposed at the same circuit. The thick copper is produced after electro-coppering and gold. The ladder circuit method is fulfilled when the film and redundant basing copper are removed.