盘中孔金属浆塞孔高平整度要求工艺开发

Development of metal paste plug hole plating technology for high flatness requirement

本文主要讲述了金属浆塞孔盘中孔平整度接近零的产品的工艺方法,以低Tg 113℃金属浆(铜浆)在FR-4材料中塞孔生产过程为范例,对比了采用正片与负片不同工艺流程生产过程中所遇到的问题、解决办法、难点及控制技巧。

This article mainly tells the story of metal plasma plug plating hole with roughness close to zero in the production process. By taking a low Tg113℃ metal pulp slurry （copper） in FR-4 material plug hole production process as an example, it compares the positive and negative films of different process in the production with analysis on problems, solutions, difficulties and control techniques.