基于图像分析技术的共晶载体清洁度表征方法

Method for Characterizing Cleanliness of Eutectic Substrate Based on Image Analysis

共晶焊是微电子组装中的一种重要焊接工艺,在混合集成工艺技术中有着重要的地位。共晶载体的清洁度是影响共晶质量的重要因素。在实际生产过程中,如何能简便、定量地测定共晶载体的清洁度是非常重要的。根据生产实际需求,用覆盖在载体上合金的空洞率来定量表征共晶载体的清洁度。即用数码摄影技术和Photoshop软件,获得一种直观、简易、定量表征共晶载体清洁度的方法。介绍了具体操作过程和注意事项。

Eutectic is an important technology of micro-electronics assembly. It is more and more used in hybrid circuit. The cleanliness of the eutectic substrate is the important factor which affects the quality of the eutectic. It is very important to how to determine the cleanliness of the eutectic substrate simply and quantitatively in real production. The void ratio of the alloy which is covered on the eutectic substrate is used to characterize the cleanliness of eutectic substrate. An intuitive, simple and quantitative method for characterizing the cleanliness of eutectic substrate was discussed by the digital photography and Photoshop software. The detailed operation process and some important points in process were indicated.