摘要
本文对IC封装钎焊位置变色现象进行了形貌和成份分析,认为变色的主要原因是Ni镀层有针孔或空洞,根本原因在电镀工艺。
In this paper, the morphology and composition of surface discoloration in brazed position ofIC package were analyzed. The main reason was that the Ni coating has pinholes or voids and the rootcause is the electroplating process.
出处
《环境技术》
2017年第4期90-92,共3页
Environmental Technology
关键词
IC管壳
钎焊镀层
变色
原因分析
IC package
brazing coating
discoloration
cause analysis
