电解铜箔毛刺缺陷的成因与对策

Cause analysis on burr defect of electrolytic copper foil and countermeasures

电解铜箔生产过程中易产生毛刺缺陷。先分析了毛刺的微观形貌和成分,再结合多年的生产实践经验,从电解液杂质和氯离子含量,溶铜罐中H_2SO_4和Cu^(2+)含量,电流密度,铜箔厚度等方面分析了毛刺产生的原因,并给出了相应的解决措施。

Burr defect is easy to form on electrolytic copper foil during its production process. The microscopic morphology and composition of burr were characterized, and then the causes to burr formation were analyzed from several respects including the contents of impurities and chloride ions in electrolyte, H2SO4 and Cu2＋ contents in copper dissolving tank, current density for electrolysis and thickness of copper foil in combination of years of practical production experience. Some countermeasures were given.