铝基覆铜板导热系数测试方法

Test Approach of Aluminum-Based Copper Clad Laminate Thermal Conductivity

铝基覆铜板(即铝基板)是电子产品的基板材料,其低导热率是设备器件可靠性、稳定度和使用寿命的保证,因此关于其导热系数测试方法的研究有着重要的意义。针对传统测试方法的不足,提出一种基于标准样本参比法和温度场函数法的新的导热系数测试方法——综合法。参比法让待测试件以样本试件为参照,利用两者已知的导热系数比值,求出待测试件导热系数;函数法根据传感器反馈的温度值建立此时的测试环境内温度分布函数模型,进而求出待测试件导热系数。两者的均方根值即为综合法所求值。基于该方法,设计了一套铝基板导热系数测试仪。实验表明该方法测试精度较高,能满足生产实践的需求。

It is very important to study the thermal conductivity of aluminum-based copper clad laminate （ alu- minum plate）, which influences the reliability, stability and service life of the device. In order to overcome the deficiencies of the traditional test methods, a new method named synthetic method is put forward for measuring thermal conductivity based on sample reference method and function method. The former takes a sample as a reference, the heat conduction parameter of a PCB is calculated with the known thermal conductivity coeffi- cient. The latter establishes the function model of the temperature distribution in the test environment according to the temperature of the feedback of the sensor, and then obtains the evaluated. The synthetic method is to cal- culate the root mean square （RMS） values for both. A novel test platform for aluminum-based copper clad lam- inate is constructed based on this approach. The experimental results show that the method has high accuracy and can meet the requirements of production practice.