基于电子标签(RFID)技术的封装工厂无纸化方案的研究

Research on Paperless Protocol of Assembly Factory Based on Electronic Label(RFID)Technology

介绍了智能卡封装的工艺流程,展示了目前工业4.0对封装工厂的系统要求,从而导出了RFI D的应用要求,进一步给出了工厂无纸化过程中使用RFI D面临的工艺与技术难题,提出并讨论了使用RFI D的初步方案,对该方案中基于RFI D技术的无纸化替代流程与原始流程进行对比。展示了RFI D所需要的系统软件开发流程,并最终加以实施,给出了实施后的结果。最后讨论今后RFI D在智能化工厂发展前景,并得出针对RFI D进一步开发应用的相关结论。

This paper introduces assembly process of smart card, displays the current system requirement of Indus- trial 4.0, and then deduces the application requirements of RFID, and further gives the process and technical issues faced by RFID application in the paperless procedure. The initial RFID application solution is suggested and dis- cussed. Two solutions between paperless procedure based on RFID technology and original procedure are compared. The software developing flow which RFID needs is displayed and implemented. The results alter the implementation are showed. Finally, prospects of RFID in smart factory, are discussed. Relevant conclusions for fiHlher development and application of RFID are drawn.