摘要
为研究真空芯片封装机热源对其热变形的影响,对真空芯片封装机进行热特性有限元分析。首先建立真空芯片封装机三维热分析有限元模型,然后分别对非真空和真空环境下的稳态温度场及热-结构耦合进行分析计算,得出了封装机各部件在两种工作条件下的热变形,最后对比分析了热变形对封装机加工精度的影响,为热误差补偿的进行提供了依据。
In order to reveal the influence of thermal source of vacuum chip packaging machine in its thermal deformation,it applies finite element method to analyze the thermal characteristics of the vacuum chip packaging machine.It builds the three dimensional thermal analysis model of vacuum chip packaging machine,calculates the steady-state temperature field and the thermal-structure coupling character of the chip packaging machine in non-vacuum and vacuum environment,obtains the thermal deformation of the main components of chip packaging machine under two working conditions,presents the impact of thermal deformation upon the machining accuracy.This provides the reference for compensation of the thermal error.
作者
王小博
周燕飞
罗福源
WANG Xiaobo ZHOU Yanfei LUO Fuyuan(School of Electrical and Mechanical Engineering, Nanjing University of Aeronautics and Astronautics, Jiangsu Nanjing, 210016, China)
出处
《机械设计与制造工程》
2017年第9期40-43,共4页
Machine Design and Manufacturing Engineering
关键词
芯片封装机
热源
温度场
热-结构耦合分析
热变形
chip packaging machine
thermal source
temperature field
thermal -structure coupling analysis
thermal deformation
