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平板水胶贴合技术及发展趋势

The Developing Trend and Technology of the LOCA Bonding in Flat Panel Display
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摘要 通过比较平板显示器硬对硬贴合中的胶材、设备和工艺差别,分析FPD硬对硬贴合中生产设备投入、贴合工艺特点、贴合气泡缺陷成因,说明了水胶贴合的优势,展望了未来贴合技术的发展趋势,指出了灌胶贴合的发展潜力,并强调了材料及洁净环境管控和工装夹具开发对提高生产效能的重要性。 The difference of the bonding adhesive, film, process and equipment in the hard- to-hard bonding were compared. The superiority and the developing trend of the liquid optical clear adhesive(LOCA) bonding, together with the potential of the adhesive-pouring bonding, was studied by means of analyzing the investment of equipment, the characteristic of bonding process, and the cause of bubbles from the hard-to-hard bonding in Flat Panel Display. In the end, the importance of guarantee of the material and clean environment was emphasized, as well as the fixture design on raising productive efficiency.
作者 刘忠安 唐宗良 LIU Zhongan TANG Zongliang(The 55th Research Institute of China Electronics Technology Group Corporation, Nanjing 210016, CHN China National Flat Panel Display Engineering Technology Research Center,Nanjing 210016 ,CHN)
出处 《光电子技术》 CAS 2017年第3期171-177,共7页 Optoelectronic Technology
关键词 水胶 狭缝涂布 灌胶贴合 贴合工艺 硬对硬贴合 平板显示 liquid optical clear adhesive slit coating adhesive-pouring bonding bondingprocess hard-to-hard bonding Flat Panel Display(FPD)
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