高均匀W-15Cu合金的制备

Preparation of High Homogeneous W-15Cu Alloy

采用理论计算和试验相结合的方法研究了平均粒径为4~6μm的W粉等静压压制规律,利用压制理论分析了压坯密度与压制力之间的关系,并推导出了两者之间的关系式。并据此选择了合适的压制成型参数,通过高温烧结W骨架和熔渗的方法制备了Cu含量为15%的CuW复合材料。通过SEM观察了W骨架和复合材料的显微组织,并测量了密度、硬度和电导率。结果表明,平均粒径为4~6μm的W粉完全符合冷等静压压制压力与压坯密度的双对数方程,采用250MPa压力,经过1 850℃烧结W骨架后制备的CuW合金Cu含量为15%,硬度(HB)达到了221,电导率为21.98 MS/m,热导率为196 W·m^(-1)·K^(-1)。

The relationship between pressing pressures and pressed densities of W powders with average size of 4~6μm was investigated systemically by combining theoretical calculation with experimental analysis,and the equation was deducted based on Huang＇s formation theory.According to the equation,the molding parameters were selected to prepare the W-15 Cu composites with W-skeleton sintered at high temperature and infiltration method.Microstructure of W-skeleton and the composites prepared was observed by SEM,and density,hardness and electric conductivity were measured.It can be found that after pressing,W powders with average size of 4~6μm can follow the Huang＇s formation theory.The Cu content in CuW composites prepared by isostatic cool pressing at 250 MPa and 1 850℃ reaches 15%,where electric conductivity,hardness（HB）and thermal conductivity reach 21.98 MS/m,221 and196 W·m-1·K（-1）,respectively.