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磁控溅射钛靶材的发展概述 被引量:11

The present status and development trend of magnetron sputtering Ti target
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摘要 详细介绍了磁控溅射Ti靶材的种类、应用及制备情况,指出了目前Ti靶材亟待解决的几个重大问题,并对靶材的发展趋势进行了探讨和展望。 The classification,application and preparation situation of the magnetron sputtering Ti target are described,the several important questions about sputtering Ti target materials which have to be resolved at moment are pointed out,moreover the development trend of sputtering target materials is also discussed and prospected in this paper.
作者 董亭义 万小勇 章程 何金江 吕保国 DONG Ting-yi WAN Xiao-yong ZHANG Cheng HE Jin-jiang LU Bao-guo(Trillion Metals Co. ,Ltd. , Beiiing 100088, China GRIKIN Advanced Materials Co. ,Ltd. , Beijing 102200, China The High Purity Metal Sputtering Target Engineering Technology Research Center in Beijing,Beijing 102200, China)
出处 《金属功能材料》 CAS 2017年第5期57-62,共6页 Metallic Functional Materials
关键词 磁控溅射 钛靶 现状 发展趋势 magnetron sputtering Ti target present status development trend
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