摘要
混合集成薄膜电路应用于微波毫米波等高频领域时,对集成的薄膜电阻阻值提出了很高的精度要求,现有工艺无法满足,作者通过分析薄膜电阻制造工艺过程,确定了集成薄膜电阻的误差来源,比对了电阻宽度和实际阻值之间的关系,找到了电阻误差的变化规律,并在此基础上提出了电阻宽度修正方法,实现了薄膜电阻阻值的精确控制。
Thin film based hybrid integrated circuits are widely used in high frequency area like microwave/millimeter waves devices, for these applications, a high accuracy of the integrated resistance value is indispensable. However, it could not be well satisfied by the state-of-art. To solve this problem, this paper investigated the fabrication process of thin film resistance and the source of error was verified. With studying the relation between pattern width and the value of resistance, the variation regularity of resistance value error was ascertained. A new method of resistance pattern width amendment was proposed and a precise control of thin film resistance value was achieved.
出处
《电子元件与材料》
CAS
CSCD
2017年第11期43-46,共4页
Electronic Components And Materials
关键词
混合集成电路
毫米波
薄膜电路
薄膜电阻
电阻误差
修正方法
hybrid integrated circuits
millimeter waves
thin film based circuits
thin film resistance
resistance value error
amendment method