摘要
对Cu/Sn-15Bi/Cu焊点在150℃下的电迁移组织演变进行了研究.结果表明,焊点阳极侧出现了近共晶相的偏聚,近共晶相厚度随电迁移时间的延长而逐渐增加;受"电子风"力的影响,钎料中Cu_6Sn_5金属间化合物逐渐向阳极侧偏聚,此外,由于阴极侧Cu_6Sn_5界面金属间化合物的脱落,钎料中的Cu_6Sn_5金属间化合物体积分数逐渐增加;焊点阴极侧界面金属间化合物厚度随电迁移时间延长逐渐增加,阳极侧界面金属间化合物厚度随电迁移时间延长先增加,后降低,当电迁移时间超过5 h后,界面金属间化合物厚度迅速增加.
The microstructure evolution of Cu/Sn-15 Bi/Cu solder joint electro-migrated at 150 ℃ was investigated. The results showed that the eutectic phase layer segregated on the anode side of solder joint. The thickness of eutectic phase layer increased as the extending of electro-migration time. The Cu6Sn5 IMCs migrated towards the anode side as the effect of electron wind. The volume fraction of Cu_6Sn_5 IMCs of solder alloy increased as the falling of Cu_6Sn_5 IMCs layer of cathode side. The thickness of interfacial IMCs layer on cathode side increased as the extending of electro-migration time. The thickness of interfacial IMCs layer on anode side increased at first and decreased then as the extending of electro-migration time when the time shorted than 5 h. Then the thickness of interfacial IMCs layer on anode side increased rapidly as the extending of electro-migration time.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2017年第10期103-106,共4页
Transactions of The China Welding Institution
基金
泰州学院校级课题资助项目(TZXY2015YBKT012)
泰州学院优秀青年教师培养资助计划项目
关键词
锡铋合金
电迁移
共晶层
偏聚
金属间化合物
Sn-15Bi
electro-migration time
eutectic phase layer
segregation
intermetallic compounds
