摘要
针对微波多层印制电路生产中,端口毛刺现象普遍存在的问题,进行了原因分析,通过多种试验,确定了通过填料填充的方法对端口毛刺可进行有效控制,并对该方法的实施有效性进行了评价。
Aimming at the common burr problem existing in the manufacture of multilayer printed circuit board in our institute,reason analysis have been carried out and through a variety of experiments, control measures of filling blocks are put forward and evaluated preliminarily.
出处
《工具技术》
北大核心
2017年第11期98-101,共4页
Tool Engineering
