静端导电块旋转镀银工艺及设备的研究

Study on Rotary Silver Plating Process and Equipment of Static Conductive Block

采用旋转电镀银的方法进行静端导电块的电镀,研究了旋转镀时的转速、有无反转设置、施镀电流密度、阳极电力线均布套筒(板)设置对镀层厚度均匀性的影响,并采用对比方法对施镀件在不同条件下,不同直径上的镀层的平均厚度、同一直径上镀层厚度的最大差值以及不同直径上镀层平均厚度的差值进行了比较。结果表明,施镀工作电流密度为0.8 A/dm^2、转速为10 r/min,设置阳极电力线均布套筒(板)时,镀层均匀性好,d为70 mm处与d为40 mm处平均镀层厚度相差仅为0.1μm。该阴极旋转镀装置在自动生产线上已成功实现了应用。

Silver rotary plating method was used for static conductive block plating. The effects of rotation rate, reverse setting, plating current density and anode electric-power line equispaced sleeve （board） on uniformity of coating thickness were studied. The average coating thickness was evaluated and compared at different conditions. The results showed that coatings prepared under the current density and rotation rate of 0.8 A/dm^2 and 10 r/min, respectively, and with anode electric-power line equispaced sleeve （board） set up had uniform thickness. The thickness difference between diameter 70 mm and diameter 40 mm was only 0.1 μm. This cathode rotary plating equipment have been successfully applied on automatic produc- tion line.