基于Lamb波的复合材料PCB基板缺陷检测仿真

Based on Lamb Wave Defect Detection Simulation of Composite Materials PCB Substrate

针对复合材料PCB(Printed Circuit Board)基板缺陷的检测,研究了Lamb波在多层复合板中的传播问题。利用有限元软件对Lamb波在复合板中的传播进行研究,并通过对复合板中缺陷的大小和尺寸对Lamb波的影响分别进行了仿真,得到相应的波形曲线。根据Lamb在板中的传播规律和传播特点,检测板中缺陷的存在。通过对波形模态的分析得到,缺陷越大,反射的回波的幅值越大;缺陷离激发点的距离越远,反射的回波幅值会越大。结果表明利用Lamb波检测复合材料PCB基板中缺陷具有一定的效果。

Aiming at the defects of composite PCB substrate, the propagation of Lamb wave in multilayer composite plate was studied. The propagation of Lamb wave in the composite plate was studied by finite element software, Lamb wave influeced by the size and dimension of flaw in the composite plate was simulated, with the corresponding waveform curve obtained. According to Lamb in the board of the law of propaga- tion and transmission characteristics, detection of the existence of defects in the board. Through the analysis of wave mode, the larger the defect, the greater the amplitude of the reflected echo;Farther away from the shot point defects, back to the amplitude of reflection. Results show the Lamb wave detecting defects in composite material PCB substrate validity and applicability of this method.