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基于环形抛光的稳态确定性抛光方法 被引量:7

Method of Steady-State Deterministic Polishing Based on Continuous Polishing
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摘要 针对环形抛光中抛光盘的面形难以精确控制的问题,以Preston方程和Winkler假定为基础,建立光学元件抛光的基本模型,通过理论分析和计算机模拟与实验,深入研究环形抛光的系统特性。结果表明,系统存在一个保持盘面面形不变的状态,此时的状态为系统的平衡状态,在平衡状态下抛光工件时无需调整校正板位置即可连续获得高精度平面;在不同的工况下,系统平衡状态对应的校正板位置不相同,应用建立的模型定量研究平衡状态下校正板位置与工件尺寸的关系。实验证明在平衡状态下抛光工件时工件的面形精度和加工效率都得到了提高。 Aiming at the problem that the surface shape of polishing pad in continuous polishing is difficult to control precisely, the basic model of optical element polishing is established based on Preston equation and Winkler assumption. Through theoretical analysis, computer simulation and experiment, system characteristics of the continuous polishing is studied further. The result shows that the system has a state that can keep the surface shape of the disk unchanged. The state of this situation is the equilibrium state of the system. It is possible to obtain the high precision plane continuously without adjusting the position of conditioning plate when the workpiece is polished in the equilibrium state. Under different working conditions, the position of the conditioning plate is different in the equilibrium state of the system. The relationship between the position of the conditioning plate and the size of the workpiece in the equilibrium state is quantitively studied by using established model. The experiments prove that the accuracy of workpiece surface shape and processing efficiency are improved when the workpieee is polished in equilibrium state.
出处 《中国激光》 EI CAS CSCD 北大核心 2017年第11期42-50,共9页 Chinese Journal of Lasers
基金 基金项目:中以高功率激光技术国际合作研究(2010DFB70490)
关键词 激光制造 环形抛光 平衡位置 面形变化速率 平衡状态 laser manufacturing continuous polishing equilibrium position surface shape change rate equilibrium state
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  • 1程灏波.基于六自由度机构平台实施自由曲面确定性抛光[J].光学技术,2006,32(z1):357-358. 被引量:1
  • 2欧阳小平,竺庆春,朱宝强,马伟新.列阵透镜对能量测量影响的分析[J].中国激光,2005,32(8):1110-1112. 被引量:2
  • 3丘悦,钱列加,黄宏一,范滇元,邓锡铭.用消衍射方法改善透镜列阵的辐照均匀性[J].中国激光,1995,22(1):27-31. 被引量:17
  • 4张学成,戴一帆,李圣怡,彭小强.磁射流抛光时几种工艺参数对材料去除的影响[J].光学精密工程,2006,14(6):1004-1008. 被引量:8
  • 5Cumbo M J. Chemo-mechanical interactions in optical polishing[D]. New York: University of Rochester, 1993.
  • 6Preston F W. The theory and design of plate glass polishing machines[J]. Journal of Society of Glass Technology, 1927, 11:214-256.
  • 7Luo Jianfeng, Dornfeld D A. Material removal mechanism in chemical mechanical polishing: theory and modeling[J]. IEEE Trans on Semicond Manuf, 2001, 14(2):112-123.
  • 8Zhao Yongwu, Chang L, Kim S H. A mathematical model for chemical-mechanical polishing based on formation and removal of weakly bonded molecular species[J]. Wear, 2003, 254:332-339.
  • 9Su Yawterng. Investigation of removal rate properties of a floating polishing process[J]. J Electrochem Soc, 2000, 147:2290-2296.
  • 10Li Yaguo, Wang Jian, Xu Qiao, et al. Effects of velocity and pressure distributions on material removal rate in polishing process[C]//Proc of SHE. 2009:7282.

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