不同固化条件对芯片粘结力的影响分析

在半导体器件可靠性中,芯片粘结力不足而引起分层的问题是经常发生。文中重点基于不同固化温度、时间对芯片粘结力的影响进行试验、分析,从而在不改变材料配方和型号的前提下选用合适的固化条件,达到提高芯片粘结力的目的。

In the reliability of semiconductor devices, it often happens delamination issue, due to the insufficient die adhesion. In this thesis, it focuses on the analysis that the influence on die adhesion, basing on different curing temperature and time. After the analysis, it can achieve the goal of enhancing the die adhesion by using the appropriate curing conditions without changing the material formula and type.