水煮处理对环氧树脂胶黏剂热膨胀性能的影响

Study on the Influence of Water Boiling on the Thermal Expansion Properties of Epoxy Adhesive

采用环氧树脂/200#聚酰胺和3369#芳香胺固化体系为基体,分别以表面处理后的氧化铝(Al2O3)、氮化硼(BN)、二氧化硅(Si O2)作为填料,制备了不同填料的环氧树脂基复合材料。研究了水煮前后两个体系热膨胀性能的变化。研究表明,200#固化体系耐水性差,水煮后高弹态平台区消失,热膨胀比水煮前明显增大,而3369#固化体系耐水性良好,水煮后固化程度加深,热膨胀较水煮前下降,线性热膨胀系数(CLTE)峰移向高温区。

Two kinds epoxy resin based composites with different fillers were prepared with the epoxy/200# polyamide and 3369# aromatic amine systems as matrix respectively and A1203 （after surface treatment）, BN, SiO2 as fillers. The thermal expansion properties of the two systems before and after water boiling were studied by using TMA and DMA methods. It was found that the 200# system was not water resistant, its high elastic state platform area disappeared after water boiling, and the thermal expansion greatly increased than before. While the 3369# system had very good water resistance, after the water boiling, its degree of curing was improved, the thermal expansion decreased and the peak of CLTE has moved to higher tem- perature.