摘要
随着芯片集成度和热流密度的不断提高,常规的深孔钻液冷冷板难以满足高热流密度芯片的散热需求。文中基于微通道散热原理,采用往返式流道,设计出了一种低流量强化换热冷板,仿真和实验结果表明:低流量强化换热冷板仅需深孔钻冷板的1/3流量即可实现与深孔钻冷板相当的散热性能;当两者流量相同时,低流量强化换热冷板的散热能力明显优于深孔钻冷板,可用于400 W/cm2高热流密度芯片的散热。
With the increase of integration degree and heat flux of chips, the conventional depth drill cooling plate cannot meet the cooling requirements of chips with high heat flux. Based on micro-channel cooling tech- nology, a new heat transfer enhancement cooling plate is designed with reciprocating channel. The simulation and experimental results show that the new cooling plate needs only 1/3 flow rate of the depth drill cooling plate to achieve similar cooling performance. For the same rate of flow, the cooling performance of the new plate is obviously better than that of the depth drill cooling plate. The new cooling plate can be used to cool the chip with high heat flux uo to 400 W/cm^2.
出处
《电子机械工程》
2017年第5期39-42,51,共5页
Electro-Mechanical Engineering
关键词
深孔钻冷板
微通道
低流量
高热流密度
depth drill cooling plate
micro-channel
low flow rate
high heat flux
