基于热电制冷的电子器件稳态散热应用分析

Analysis of Steady Heat Dissipation Application to Electronic Components Based on Thermoelectric Cooling

文中采用了一种基于热电制冷的新型热管理方法,介绍了其基本原理、散热性能以及应用分析。以某固态功放单元散热为设计实例,通过数值仿真和实验测试分别得到了功放芯片在传统风冷散热装置以及接入热电制冷片时的温度数据,并对比分析了改变制冷片电压对降温效果的影响。结果显示,接入热电制冷片后,热源模块的盒体底面温度下降了10℃以上,表明了热电制冷片良好的散热性能。

This paper presents the fundamental principles, thermal performance and application analysis of a thermal management method based on thermoelectric cooling. Taking a certain solid power amplifying unit as a design example, the temperature data are obtained about power amplifying chips of the traditional air cooling device and after the thermoelectric cooling slice is inserted by the numerical simulation and experiment. At the same time, it is found that changing the voltage of the cooling slice has an effect on the cooling effect through comparison and analysis. The results show that the box bottom temperature of the heat source module drops more than I0 -C after the thermoelectric cooling slice is inserted. It＇s demonstrated that the thermoelectric cooling slice has good heat dissipation performance.