激光诱导等离子体刻蚀Pyrex7740玻璃工艺研究

Process Study on Laser Induced Plasma Etching of Pyrex7740 Glass

通过控制变量法研究了激光能量密度、加工速度、重复频率、刻蚀次数等激光加工参数对紫外激光诱导等离子体刻蚀Pyrex7740玻璃刻蚀深度和表面刻蚀质量(包括边缘是否齐整、崩边、碎裂等)的影响规律。结果表明,以铜膜作为吸收层的紫外激光诱导等离子体刻蚀Pyrex7740玻璃的激光能量密度阈值在1.54~2.10J/cm^2之间,且在一定范围内激光能量密度越大,刻蚀深度越深,等离子体越稳定,刻蚀质量越好;激光刻蚀速度过慢或过快都会造成等离子体不稳定,对刻蚀质量产生不良影响,即并非光斑重叠度越大刻蚀效果越好。研究结果为激光诱导等离子体精密刻蚀Pyrex7740玻璃及其他光学透明材料刻蚀工艺优化和参数选取提供参考。

The laser processing paremeters such as laser energy density,processing speed,pulse repetition frequency,the number of laser etching and so on were studied by means of the parameter control method to figure out the influence rule of UV laser induced plasma etching Pyrex7740 glass etching depth and machined surface quality.The results show that the laser energy density threshold of UV laser induced plasma etching Pyrex7740 glass is between 1.54~2.10 J/cm2 when using copper film as absorbing layer.With the laser energy density increasing in a certain range,the etching depth and the stability of plasma will increase and the machined surface quality will improve.The too fast or too slow laser etching speed will cause the instability of plasma,which lead to a bad effect of machined surface quality.Namely,not the higher the overlap degree is,the better the machined surface quality.The research results provide reference for processing optimization and parameter selection of laser induced plasma etching Pyrex7740 glass or other optical transparent materials.