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Cu-Cr-In合金形变热处理过程的组织与性能演变研究 被引量:8

Microstructural Evolution and Mechanical Property of Cu-Cr-In Alloy during Thermo-Mechanical Treatment
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摘要 对Cu-0.70Cr-0.15In合金在形变热处理过程中的显微组织及电导率、抗拉强度等演变规律进行了研究。合金铸态组织中,在α相周围不连续分布着(α+Cr)共晶体,In均匀分布于α基体相中;合金在低于500℃时效,依然能清晰保持着时效前冷变形组织形貌,550℃时效120 min后可观察到少量的再结晶组织。结果表明,在经过1000℃×60 min的固溶处理及应变ε为80%的冷变形工艺后,合金在450℃×60min时效后具有最优的电导率和抗拉强度综合性能,其电导率和抗拉强度分别达到81.41%IACS和544 MPa,延伸率δ为13%。合金时效后再经过45%的冷变形,其抗拉强度得到迅速提升,达到641 MPa,电导率和延伸率分别仍可维持在81.2%IACS和4.5%。软化温度测试结果表明,合金时效态和"时效+冷变形"态的软化温度分别为525和440℃。 Microstructures of Cr-0.70Cr-0. 15In alloy during the thermo-mechanical process were observed and the electrical conduc- tivity and tensile strength were tested. The α matrix phase was surrounded by (α + Cr) enteetic discontinuously while indium(In) dissolved in the α matrix phase homogeneously. Typical microstructures after cold deformation were preserved after ageing at temperatures below 500 ℃ , while a small amount of recrystallization structures were observed after aging at 550℃ for 60 min. The results showed that the alloy aged at 450 ℃× 60 min had a good combination of properties-electrical conductivity, tensile strength and elongation being 81.41% IACS, 544 MPa and 13% , respectively. The tensile strength increased to 641 MPa after 45% cold deformation following aging, and conductivity and elongation were still maintained at 81.2% IACS and 4.5%. The softening tests showed that softening temperature of the as-aged and ageing-cold deformation states reached 525 and 440 ℃ , respectively.
作者 李明茂 张小平 陈辉明 汪航 杨斌 Li Mingmao;Zhang Xiaoping;Chen Huiming;Wang Hang;Yang Bin(Institute of Engineering Research, Jiangxi University of Science and Technology, Ganzhou 341000, China;School of Materials Science and Engineering, Jiangxi University of Science and Technology, Ganzhou 341000, China;Jiangling Motors Corporation, Ltd., Nanchang 330001, China)
出处 《稀有金属》 EI CAS CSCD 北大核心 2017年第12期1311-1317,共7页 Chinese Journal of Rare Metals
基金 国家重点研发计划"重点基础材料技术提升与产业化"重点专项项目(2016YFB0301400) 江西省委组织部赣鄱555领军人才基金项目(2012215)资助
关键词 高强高导 Cu—Cr—In 微观组织 软化温度 high strength and high conductivity Cu-Cr-In microstructure softening point
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