超晶格结构对铝硅界面热阻的影响

Effect of Superlattice on The Thermal Resistance of Aluminum and Silicon Interface

近年来,提高微纳电子器件的散热和原子尺度界面热输运性能受到了广泛的关注,很重要的原因是界面热阻导致的微纳电子器件发热制约了性能的稳定性。因此,我们提出利用超晶格结构来降低界面热阻的方法。本文采用非平衡分子动力学模拟的方法,研究了室温(300 K)下硅同位素超晶格结构对铝硅界面热阻的影响。计算结果表明利用硅超晶格结构可以明显地降低铝硅界面热阻。并且对结果给予了讨论,这有助于更好地理解界面热输运的机制。

In recent years, improving the micro/nano electronic devices heat dissipation and the thermal transport properties of the material interfaces has become a widespread concern. The important reason is that the thermal interface resistance results in the micro/nano electronic devices heating, which restricts the devices＇ performance. So we propose a method to decrease the thermal interface resistance by using superlattice structure. In this paper, the thermal interface resistance between Al and SiSL was simulated by a non-equilibrium molecular dynamics method. Our results show that using SisL can decrease the thermal interface resistance obviously. And we also give some theory analysis, it is better for us to understand the mechanism of the interracial heat transfer.