新型潜伏性环氧树脂固化剂ADI的合成及性能研究

Research on synthesis and performance of novel latent epoxy resin curing agent ADI

以偏二甲肼、环氧丙烷和正癸酸甲酯为原料,合成新型热潜伏性环氧树脂固化剂1,1–二甲基–1–(2–羟丙基)胺–2–癸酰亚胺(ADI),并采用傅里叶变换红外光谱、核磁共振波谱和元素分析,确定了产物的结构,借助热重同步差热分析仪,研究了产物的热分解特性以及ADI/E–44双酚A环氧树脂体系固化反应热行为。结果表明:ADI/E–44双酚A环氧树脂固化温度为100℃,固化时放热平稳,常温下潜伏期在60 d以上。

Using unsymmetrical dimethyl hydrazine, propylene oxide and methyl n-decanoate as raw materials, the novel latent epoxy resin curing agent 1,1-dimethyl-1-（2-hydroxypropyl）amine-2-decanoate （ADI） was synthesized. The structure of product was confirmed by using Fourier-infrared spectrum, nuclear magnetic resonance spectrum and elemental analysis. The thermal decomposition characteristic of the product and the thermal behavior of curing reaction fo~ ADI/E-44 bisphenol A epoxy resin system were investigated by using the thermogravimetric synchronous differential thermal analyzer. The results show that the curing temperature of ADI/E-44 bisphenol A epoxy resin is 100℃, the heat release is stable during the curing, the latent period at ambient temperature is more than 60 d.