熔融盐电镀Ta的工艺优化及镀层性能分析

Process Optimization and Property Analysis of Molten Salt Electroplating Tantalum

目前,通过电镀法获得Ta镀层的报道较少。采用正交试验对熔盐镀Ta的工艺参数进行优选,研究时间、温度、电流密度和表面粗糙度对镀层性能的影响,并对Ta镀层的表面形貌、镀层厚度、镀层退火前后物相、化学成分、硬度和结合强度进行分析。结果表明:电镀时间3 h,温度750℃,电流密度80 m A/cm2,试样表面粗糙度0.05μm时,所得镀层均匀连续,厚度约15μm;800℃下退火4 h可提高镀层结晶度,使亚稳相向α相转变;镀层与基体结合处存在疏松氧化结构,镀层结合强度为40 N左右。

Effects of time, temperature, current density and surface roughness on the properties of Ta coating were studied by orthogonal experiments, and the surface morphology, coating thickness, chemical composition, hardness and bonding strength of Ta coating were analyzed. Results showed that when the process conditions were as follows： plating time 3 h, temperature 750 ~C, current density 80 mA/cm2 and roughness 0.05 p,m, the prepared coating was homogeneous and continuous with a thickness of about 15μm. Plating degree of crystallinity could be improved by annealing at 800℃ for 4 h, and the metastable phase transformed to α phase. There was a loose oxidation structure between the coating and the substrate, and the coating bonding strength was about 40 N.