摘要
单粒子翻转(Single Event Upset,SEU)效应是机载复杂电子硬件设计所必须考虑的重要问题,对SEU效应进行了描述,分析了复杂电子设备经常用到的芯片类型(专用集成电路器件、反熔丝FPGA、SRAM型FPGA、Flash型FPGA)及其优缺点,总结了三模冗余、纠错码、擦洗、系统监控这四种常见的SEU减缓技术,对于国内民机机载复杂电子硬件的设计具有参考意义。
Single Event Upset( SEU) effect is an important issue which has to be considered in the design ofairborne complex electric hardware.This paper describes SEV effect,analyzes types of chips commonly used in the complex electric equipment( ASIC,anti-fuse FPGA,SRAM-based FPGA and Flash-based FPGA) as well as their advantages and disadvantages,and summaries four common SEU mitigation technologies,namely triple-moduleredundancy,error correction code,scrubbing and system monitoring,thus providing references for the design ofairborne complex electric hardware for domestic civil aircraft.
出处
《电气自动化》
2017年第6期32-33,54,共3页
Electrical Automation
关键词
单粒子翻转
专用集成电路器件
现场可编程门阵列
三模冗余
复杂电子硬件
single event upset(SEU)
application-specific integrated circuit(ASIC)
field-programmable gate array(FPGA)
triple-module redundancy
complex electric hardware