功率半导体器件表面钝化技术综述

Review of Surface Passivation Process for Power Semiconductor Devices

表面钝化技术是半导体器件制造过程中的重要工艺环节,对器件的电学特性和可靠性有重要影响。文中侧重于功率器件领域,回顾了各种高压结终端所需的不同钝化工艺,包括平铺叠加的复合介质膜、有机聚合物覆盖、玻璃或有机聚合物填充等。综述了钝化工艺中所采用的各种钝化材料的性质和功能,给出了它们在功率器件结构中的典型数据,包括二氧化硅、磷硅玻璃、氮化硅、氮氧化硅、三氧化二铝、半绝缘多晶硅、聚酰亚胺(PI)、玻璃料等,并对新近用于钝化的苯并环丁烯、氢化无定形碳化硅和氢化无定形碳等材料进行了介绍和展望。

Surface passivation technology plays a key role in the production process of semiconductor devices,which has important influence on the electrical characteristics and reliability of the devices.Focusing on the field of power devices,this paper reviews the various passivation processes required for different high-voltage junction termination,including multi-layer dielectric films,organic polymer coatings,glass or organic polymer refilling.The properties and functions of various passivation materials employed in these passivation processes are also reviewed,and their typical data in the structures of power devices are given,including SiO_2,PSG,Si_3N_4,SiO_xN_y,Al_2O_3,SIPOS,PI,glass frit,etc.Finally,materials such as BCB,α-Si C: H,α-C: H,which was newly introduced into the passivation process,and their application prospect are discussed.